Monozukuri S.p.A, today unveiled GENIO™, the first commercially available IC/Package Co-Design Tool. The company said that is able to take orders for GENIO™ now.
GENIO™ is revolutionary fully integrated, design environment-agnostic end-to-end IC and packaging co-design EDA platform for 2D/2.5D/3D system design.
GENIO™ integrates existing silicon and package EDA flows to create full co-design and I/O optimization of complex multi-chip designs that comprise advanced heterogeneous microelectronic systems. It is the first tool to seamlessly work across all existing EDA flows to maximize design efficiency and system optimization.
“GENIO™ is not a promise or partial solution. It is a breakthrough, ground-up tool that is ready for implementation today,” said Anna Fontanelli, Founder and CEO.
“GENIO™’s holistic design environment includes complete floor planning, I/O planning and end-to-end interconnect planning combined with cross-hierarchical pathfinding optimization”, she explained.
Equally important is the fact that GENIO™ is agnostic to all EDA flows. It is not a ‘bolt on’ capability like other co-design options, but a total re-conceptualizion and implementation that maximizes design efficiency across system level design.
GENIO™ ’s complete cross-hierarchical, 3D-aware, design methodologies streamline the entire IC eco-system. It integrates IC and advanced packaging design to ensure full system level optimization, shorten the design cycle, drive faster time-to-manufacturing and improve yields.
The Duet™ graphic user interface (GUI) creates an environment where cross-fabric structures can be imported, created, and stored in a common database. The system’s efficient automation allows designers to create, explore, optimize and compare different floor-planning, scenarios and dynamically modify and store optimization results according to the final configuration.
As an integrated IC and packaging co-design EDA tool, GENIO™ sets a new benchmark for creating heterogeneous microelectronic systems-level design for advanced applications such as artificial intelligence, virtual reality and web scale infrastructure.