How it works
A marketing function
of Monozukuri
A privately held company based in Rome, Italy.
Exponential
Innovation
We believe the future will be shaped by exponential innovation, and we’re committed to creating a technology design nexus that transforms visionary ideas into tomorrow’s reality.
Constant
Development
MZ Technologies is visionary, innovative, and committed. Since 2015, we’ve developed EDA solutions for advanced packaging, enabling next-gen, vertically stacked ICs with superior time-to-market and yield-to-volume.
What we do
Global Technology.
European Culture.
Italian Workmanship.
01
We deliver tools that enable next-gen vertically stacked, modular IC designs with faster time-to-market and high yield.
02
We are dedicated to creating the technology design nexus that transforms visions of the future into tomorrow’s innovative reality.
03
We blend technical expertise with a client-first approach to deliver innovative, reliable EDA solutions.
04
We offer tailored solutions for concept design, 2.5D/3D chiplet systems, and advanced heterogeneous integration.
05
Bringing your visionary ideas to life by accelerating time-to-market, ensuring quality, and driving technological advancement.
A cross-fabric
platform
GENIO EVO is a cross-fabric platform for system design providing chiplets/die, silicon interposer, package, and surrounding PCB co-design features that achieve area, power, and performance targets.
It’s technology agnostic and seamlessly integrates through standard formats with all the existing commercial implementation platforms or to custom EDA flows through dedicated plug-ins.Advanced Packaging Architectural Exploration and Connectivity Management
Multi-physics
Design Cockpit
Mechanical Stress, Thermal, TSV
Accordingly to identified thermal hotspot
(CoWoS, InFO, SoIC, Foveros, EMIB, FoCoS, Swift, EFB…)
What’s New
GENIOEVO™ – Architectural Exploration and Connectivity Management in Advanced Packaging
A Discussion of how GENIOEVO addresses Architectural Exploration and Connectivity Management in Advanced Packaging – With Daniel Nenni and Anna Fontanelli. Advanced packaging is a set of techniques used in
GENIOEVO™ – A Multi-Physics Design Cockpit for Heterogenous 3D Integration
A Discussion of how a Multi-Physics Design Cockpit can cope with the Challenges and Strategies for Heterogeneous 3D Integration – With Daniel Nenni and Anna Fontanelli. 3D heterogeneous integration is a promising
MZ Technologies To Exhibit at Chiplet Summit Unveils Next Generation Chiplet/Package Design Tool
Will highlight GENIOEVO next generation chiplet/package design tool MZ Technologies, a leading supplier of innovative solutions and methodologies for 2.5 and 3D design, will be exhibiting at Chiplet Summit, January