News

A Discussion of how GENIOEVO addresses Architectural Exploration and Connectivity Management in Advanced Packaging – With Daniel Nenni and Anna Fontanelli. Advanced packaging is a set of techniques used in

A Discussion of how a Multi-Physics Design Cockpit can cope with the Challenges and Strategies for Heterogeneous 3D Integration – With Daniel Nenni and Anna Fontanelli. 3D heterogeneous integration is a promising

Will highlight GENIOEVO next generation chiplet/package design tool MZ Technologies, a leading supplier of innovative solutions and methodologies for 2.5 and 3D design, will be exhibiting at Chiplet Summit, January

Tackling the barriers to 3D-IC design architecture MZ Technologies has unveiled an updated technology roadmap for its GENIO™branded integrated chiplet/packaging Co-Design EDA tool. The roadmap calls for major improvements throughout

MZ Technologies is a unique company that enables multi-die design by providing critical planning and analysis tools that sit above the traditional EDA design flow. Chip and package design tools

The next design revolution is clearly upon us. Traditional Moore’s Law is slowing, but the exponential demand for innovation and form factor density is not. When you can no longer

Chip/Package Co-Design May Fulfill a Second “Moore’s Law” Gordon Moore predicted the demise of Moore’s law and envisioned in its place larger systems built from smaller, separately packaged, interconnected systems,

Monozukuri CEO, Anna Fontanelli, in a wide-ranging interview with SemiWiki editor, Dan Nenni, provided a glimpse into the future of MZ Technologies and silicon/package co-design. Read the entire interview here:

MZ Technologies’ GENIO Tool Suite adopted for Major System-in-Package IC An internationally respected System/ASIC company is adopting MZ Technologies’ GENIO™ 1.7 fully-integrated EDA co-design tool.     The company adopted a full-suite license